i4F Be-Lite technology is more sustainable than ever

 Tuesday, October 4, 2022

i4F Be-Lite is a new, patented technology that enables a significant reduction in the use of core SPC raw materials during the manufacturing process of decorative panels without compromising on performance. Because SPC panels produced using i4F Be-Lite are significantly lighter, it is a lot less expensive to make and transport them. It significantly improves the flooring industry’s carbon footprint while remaining attractive to manufacturers by also delivering costs savings. That makes a meaningful difference and is truly a win:win for the industry and the planet.

i4F Be-Lite is exclusively available via an i4F license as part of its portfolio of sustainability-focused process technologies. The technology is the result of a patent partnership with CFL Flooring. “We are passionate about bringing meaningful technologies to market, and there is nothing more important than a greener future.”

Bee prepared to bee impressed

i4F Be-Lite is a thermoforming technology that, depending on panels’ core thicknesses and i4F Be-Lite shape selected, uses up to 20% less raw materials during the panel core manufacturing process. This differs to other existing material savings techniques that remove and recycle materials after the panel production process, creating more costs and CO2 emissions linked to transport and recycling of scrap.

The resulting, lighter SPC panels maintain optimum performance while easily reducing at least 5% of a panel’s total manufacturing raw material costs as well as decreasing transport costs by at least 6%.

Tags: flooring industry, flooring technology, i4F Be-Lite, sustaiability, wood, wood and panel, woodworking and manufacturing, woodworking event, woodworking industry